The Mech-EL 827 Wire/Chip Ball Bonder is a precision bonding machine designed for semiconductor applications. This unit includes a StereoZoom 4 microscope head for enhanced visibility during bonding processes.
- Brand: Mech-EL
- Model: 827
- Included: StereoZoom 4 Microscope Head
- Condition: Used, in good working order
Ideal for research and development labs, this wire/chip bonder ensures high-quality bonding for semiconductor devices.
Why Buy from SPW Industrial?
Trusted by over 57,000 customers since 2015. Every product from SPW Industrial is backed by our One-Year Replacement Warranty. If your item fails within one year of purchase, we will replace it at no additional cost. Shop with confidence knowing you are covered.
Shipping & Delivery |
We ship Worldwide. Get shipping and tax estimate by adding the item into your shopping cart. Estimated delivery time will depend on shipping service selected and receipt of cleared payment. Delivery times may vary |
Payment | We accept paypal and all major credit cards
|
Returns |
30 Days Money Back Guarantee: Get the item you ordered or get your money back. Non Defective: Within 30 days after delivery |
